The May meeting of the Silicon Valley Chapter of the IEEE Electronic Packaging Society (EPS) will feature a webcast by Dr. Zia Karim, Chief Technical Officer at YES, entitled “Results of Low-Temperature Polyimide Processing for Interconnect RDL in Next-Generation 3D Advanced IC Backend Applications.” Please visit the IEEE for details.
This event will be held on Thursday, May 6, 2021 at noon PDT. For reservations and the WebEx link, go to eps2105a.eventbrite.com. Check-in will begin at 11:50am PDT. This event is free of charge.