Advanced Packaging Blogs

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YES CTO Dr. Zia Karim to Address IEEE EPS Silicon Valley Chapter

by YES Marketing, April 30, 2021

The May meeting of the Silicon Valley Chapter of the IEEE Electronic Packaging Society (EPS) will feature a webcast by Dr. Zia Karim, Chief Technical Officer at YES, entitled “Results of Low-Temperature Polyimide Processing for Interconnect RDL in Next-Generation 3D Advanced IC Backend Applications.” Please visit the IEEE for details. This event will be held on Thursday, May […]

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YES Sponsoring the Virtual IMAPS Device Packaging Conference

by YES Marketing, April 9, 2021

Visit YES at the virtual IMAPS Device Packaging Conference from April 12-15! You may register now for a complimentary Partner Profile Only Badge, which is comparable to a free Exhibit Hall pass at an in-person show and enables you to chat with us and other Partners. (Note that the complimentary badge does not provide access to any presentations/technical content, […]

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