Bonding Solutions for Next-Generation Advanced Packaging

Reliable, effective bonding technology is success-critical for today’s advanced packaging applications. This webinar will discuss current and emerging heterogeneous integration architectures, and technologies for achieving strong wafer-to-wafer bonds, advanced solder interconnects, and future structures using hybrid bonding. Various technologies and material systems used in temporary bond/debond for backside processing, and an exciting new reversable bonding technology for silicon and non-silicon substrates will also be discussed. The moderator is Françoise von Trapp, editor and founder of 3D InCites. Speakers include Adel Elsherbini, Senior Principal Engineer at Intel; Luke Prenger, Research Associate & Team Leader at Brewer Science; and Zia Karim, Chief Technology Officer of YES.

YES (Yield Engineering Systems, Inc.) is a preferred provider of high-value, high-throughput equipment for material and surface enhancement.

Date: Thursday, December 02, 2021
Time: 09:00 AM Pacific Standard Time
Date: Friday, December 03, 2021
Time: 09:00 AM China Standard Time