VeroTherm™ FAR - Yield Engineering Systems

Solutions

USE CASE

Process and Manufacturing Engineering

Process Design and Development

Research and Academics

INDUSTRY

Advanced Packaging

Genomics and IVD

Medical Devices

Optics

3D Printing

Aerospace and Defense

Front-end Semiconductors

MEMS

IoT and Sensors

APPLICATIONS

Adhesion Promotion

BCB Cure

Copper Capping

Copper Annealing

Dehydration

Fan Out Wafer Level Packaging

Image Reversal

Low-k Dielectric

Organics Removal

Photoresist Treatment

Plasma Cleaning

Polyimide Cure

PR Strip/Descum

Resist Adhesion

Silane Coating

Silylation

Vapor Deposition

Vapor Phase Deposition

Wirebond Preparation

WLP

SERVICES

Manufacturing as a Service

Joint Product Development

Field Services

Proof of Concept/Prototyping
Products

CLEAN

RFS

G Series

EcoClean

COAT

EcoCoat

UltraCoat

TA Series

CURE

PB Series

VertaCure PLP

VertaCure XP G2

BOND

VertaBond

REFLOW

VeroTherm FAR

WET PROCESS

Wet Clean/Etch

Electroless Plating

Electrolytic Plating

PARTS

Cassettes, Software, and Parts
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CONTACT US

CONTACT US

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VeroTherm™ FAR

Fluxless Formic Acid Reflow System