YES (Yield Engineering Systems, Inc.) is a leading provider of process engineering equipment and lab-to-fab solutions for transforming surfaces, materials and interfaces. Product lines at YES include vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, biosensors and medical substrates.
Additionally, YES offers complete lab-to-fab solutions, Manufacturing as a Service (MaaS), and process/product design services via the renowned YES Applications Labs and Product Development Centers located in North America, APAC, and EMEA. YES is headquartered in Fremont, California.
Much of the most important innovation in the life sciences, emerging technologies, advanced semiconductor packaging, and other industries will involve breakthrough technologies made possible by modifying materials, surfaces, and interfaces at the nanoscale.
At YES, our mission has been to transform the speed, reliability, and cost-effectiveness of process engineering equipment and solutions to serve customer needs for modified materials, surfaces, and interfaces from lab to fab. With our patented technologies, enterprises and startups can practice agile innovation, modifying materials and surfaces to create breakthrough new products.
Through patents such as “Vapor Deposition System, YES-1224P,” YES has completely reimagined process engineering solutions for the modern world. Consider that any company can be agile when using, for instance, YES VertaCure systems to:
- Increase process speeds for typical curing applications by 50% or more
- Improve reliability significantly over atmospheric curing systems
- Conserve valuable fab real estate by attaining throughput goals with fewer systems
Additionally, the YES equipment portfolio offers solutions to inject much greater speed, reliability, and cost-effectiveness into the entire process engineering life cycle. YES systems can be configured for almost any current and emerging use case.