PRODUCTS
YES manufactures precision cleaning, coating, and curing equipment for innovative leaders in the life sciences, emerging technologies, and advanced semiconductor packaging. Start your journey to breakthrough technologies with shorter process times, higher yields, improved reliability, and lower total cost of ownership.
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CLEAN COAT CURE PARTS
Clean Systems
Choose from three series of YES Clean Systems for gentle surface cleaning, decontamination, and surface activation. YES Clean Systems can also descum and strip off photoresist using downstream plasma. Unique benefits of YES Clean Systems include:
  • Reduction in equipment footprint by half over competition
  • Lower cost of ownership by almost 50%
  • Proven high reliability from system designs with as few as three moving parts
Applications
  • Plasma Cleaning
  • Photoresist removal/descum
  • Polyimide, organics and CuO removal
  • Surface activation
  • Adhesion promotion
  • Plasma surface decontamination
RFS Series
RFS Series
Eco Clean Series
EcoClean
G series
G Series
RFS Series

User-friendly plasma cleaning systems provide higher yields and repeatable results.

  • Removes thick layers of photoresist or polyimide quickly (up to 6,000-7,000 Å/min)
  • Applications range from aggressive strip processes to gentle descum and surface modification
  • Downstream process balances plasma charge and protects against damaging UV exposure
  • Precise temperature control for uniform, repeatable results Up to four (4) process gas connections
  • Up to four (4) process gas connections
RFS Series

User-friendly plasma cleaning systems provide higher yields and repeatable results.

  • Removes thick layers of photoresist or polyimide quickly (up to 6,000-7,000 Å/min)
  • Applications range from aggressive strip processes to gentle descum and surface modification
  • Downstream process balances plasma charge and protects against damaging UV exposure
  • Precise temperature control for uniform, repeatable results Up to four (4) process gas connections
Coat Systems
Modify surfaces at the nanoscale with YES Coat Systems, which apply monolayer coatings to induce hydrophobic (water-repelling) or hydrophilic (water-attracting) properties. With YES Coat Systems, coat a variety of substrates with unique benefits including:
  • Choose among 100+ chemical precursors
  • Achieve up to 3X improvement in temperature uniformity over our competition
  • Leverage YES expertise and proven history in deploying thousands of systems across various emerging industries
Applications
  • Surface modification
    (adhesion/hydrophobic/hydrophilic)
  • Adhesion improvement
  • Anti-stiction layer
  • Surface priming for microarrays
  • DNA sequencing and microfluidics
  • Self-assembled monolayer deposition
    and removal
  • Seed layer for metallization
LabCoat
LabCoat
EcoCoat
EcoCoat
VertaCoat
VertaCoat
TA Series
TA Series
LabCoat

R&D Silane Monolayer Deposition System

  • Compact, tabletop unit ideal for R&D labs
  • Flexible system accommodates a variety of silanes, processes and surfaces
  • Vacuum dehydration followed by silane vapor deposition coating
  • Provides stable surface after exposure to atmospheric moisture
  • Contact angle repeatability within ±1-3°
  • Angstrom-level thickness control
LabCoat

R&D Silane Monolayer Deposition System

  • Compact, tabletop unit ideal for R&D labs
  • Flexible system accommodates a variety of silanes, processes and surfaces
  • Vacuum dehydration followed by silane vapor deposition coating
  • Provides stable surface after exposure to atmospheric moisture
  • Contact angle repeatability within ±1-3°
  • Angstrom-level thickness control
image coming soon Cure Systems
Transform materials using thermal and chemical processes via YES Cure Systems for emerging technology and emerging research needs. For instance, semiconductor manufacturers have used YES Cure Systems to cure polyimide precursors for advanced packaging. With YES Cure Systems:
  • Achieve up to 50% improvement in cure time
  • Cut total cost of ownership (TCO) in half
  • Improve the performance of products with less outgassing, greater film stability, and higher reliability
Applications
  • Polyimide, BCB or PBO cure
  • Wafer-to-wafer bonding anneal
  • Vacuum anneal up to 400°C
  • Pre-metal or pre-PVD bake and degas
PB Series
PB Series
Verta Cure
VertaCure
PB Series

Manual Load High-Temperature Vacuum Cure Systems

  • Faster process: 3.5 hours vs 8+ hours
  • Laminar flow reduces/eliminates particles
  • More complete cure (5x less outgassing)
  • Less film stress and low wafer warpage
  • 1.6x to 2x less power and N2 consumption
  • Much lower capital cost, 2-3x lower CoO
PB Series

Manual Load High-Temperature Vacuum Cure Systems

  • Faster process: 3.5 hours vs 8+ hours
  • Laminar flow reduces/eliminates particles
  • More complete cure (5x less outgassing)
  • Less film stress and low wafer warpage
  • 1.6x to 2x less power and N2 consumption
  • Much lower capital cost, 2-3x lower CoO
Cassettes, Software, and Parts

YES offers a complete portfolio of cassettes and software for YES Clean, Coat, and Cure systems. You may also order customized cassettes and additional replacement parts for YES systems.

Other Parts, Accessories, and Software

Contact us to order replacement door seals and optional parts for your YES equipment.

YES (Yield Engineering Systems, Inc.)
3178 Laurelview Ct.
Fremont CA 94538
1-510-954-6889
Toll Free: 1-888-YES-3637
www.yieldengineering.com