Low-temp bonding and high-temp vacuum anneal in one automated system.

Convective N₂ cooling and radiation prevents thermal shock wafer breakage

Removes thick layers of photoresist or polyimide in the shortest production time.

Manual plasma cleaning: RF plasma with 40 kHz or 13.56 MHz.

Eco-friendly plasma resist strip/descum system is 2-5X faster at half the cost

Silane monolayer deposition/prime system with plasma: precise, low-cost surface modification.

Automated Silane Monolayer Deposition System. Contact us for more information.

HMDS prime and image reversal ovens achieve stable process results with fewer chemicals.

Manual high-temperature vacuum cure systems accelerate throughput from 8+ to 3.5 hours.

Automated vacuum cure systems offer double the throughput speed of atmospheric curing.

Automated high-volume cure system for panels.

Wet Process Surface Prep System for Wafers, Polysilicon Chunk & Custom Substrates

Suffix delivers the industry’s best autocatalytic plating performance

Better durability and performance over quartz cassettes. Standard and specialty dimensions.