DATASHEETS
View or download helpful information about YES equipment and services.
Bond
VertaBond
Low-temp bonding and high-temp vacuum anneal in one automated system.
Reflow
VeroTherm™️ FAR
Convective N₂ cooling and radiation prevents thermal shock wafer breakage
Clean
RFS
Removes thick layers of photoresist or polyimide in the shortest production time.
G Series
Manual plasma cleaning: RF plasma with 40 kHz or 13.56 MHz.
EcoClean
Eco-friendly plasma resist strip/descum system is 2-5X faster at half the cost
Coat
EcoCoat
Silane monolayer deposition/prime system with plasma: precise, low-cost surface modification.
UltraCoat
Automated Silane Monolayer Deposition System. Contact us for more information.
TA Series
HMDS prime and image reversal ovens achieve stable process results with fewer chemicals.
Cure
PB Series
Manual high-temperature vacuum cure systems accelerate throughput from 8+ to 3.5 hours.
VertaCure XP
Automated vacuum cure systems offer double the throughput speed of atmospheric curing.
VertaCure PLP
Automated high-volume cure system for panels.
Wet Process
Automated Linear Transfer (ALT)
Wet Process Surface Prep System for Wafers, Polysilicon Chunk & Custom Substrates
Suffix Electroless Plating System
Suffix delivers the industry’s best autocatalytic plating performance
Cassettes
Stainless Steel Cassettes
Better durability and performance over quartz cassettes. Standard and specialty dimensions.