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Low-temp bonding and high-temp vacuum anneal in one automated system.
Convective N₂ cooling and radiation prevents thermal shock wafer breakage
Removes thick layers of photoresist or polyimide in the shortest production time.
Manual plasma cleaning: RF plasma with 40 kHz or 13.56 MHz.
Eco-friendly plasma resist strip/descum system is 2-5X faster at half the cost
Silane monolayer deposition/prime system with plasma: precise, low-cost surface modification.
Automated Silane Monolayer Deposition System. Contact us for more information.
HMDS prime and image reversal ovens achieve stable process results with fewer chemicals.
Manual high-temperature vacuum cure systems accelerate throughput from 8+ to 3.5 hours.
VertaCure XP G2
Automated vacuum cure systems offer double the throughput speed of atmospheric curing.
Automated high-volume cure system for panels.
Automated Linear Transfer (ALT)
Wet Process Surface Prep System for Wafers, Polysilicon Chunk & Custom Substrates
Suffix Electroless Plating System
Suffix delivers the industry’s best autocatalytic plating performance
Stainless Steel Cassettes
Better durability and performance over quartz cassettes. Standard and specialty dimensions.