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Clean Systems- Reduction in equipment footprint by half over competition
- Lower cost of ownership by almost 50%
- Proven high reliability from system designs with as few as three moving parts
- Plasma Cleaning
- Photoresist removal/descum
- Polyimide, organics and CuO removal
- Surface activation
- Adhesion promotion
- Plasma surface decontamination
User-friendly plasma cleaning systems provide higher yields and repeatable results.
- Removes thick layers of photoresist or polyimide quickly (up to 6,000-7,000 Å/min)
- Applications range from aggressive strip processes to gentle descum and surface modification
- Downstream process balances plasma charge and protects against damaging UV exposure
- Precise temperature control for uniform, repeatable results Up to four (4) process gas connections
- Up to four (4) process gas connections
User-friendly plasma cleaning systems provide higher yields and repeatable results.
- Removes thick layers of photoresist or polyimide quickly (up to 6,000-7,000 Å/min)
- Applications range from aggressive strip processes to gentle descum and surface modification
- Downstream process balances plasma charge and protects against damaging UV exposure
- Precise temperature control for uniform, repeatable results Up to four (4) process gas connections
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RFS Series
User-friendly plasma cleaning systems provide higher yields and repeatable results.
- Removes thick layers of photoresist or polyimide quickly (up to 6,000-7,000 Å/min)
- Applications range from aggressive strip processes to gentle descum and surface modification
- Downstream process balances plasma charge and protects against damaging UV exposure
- Precise temperature control for uniform, repeatable results Up to four (4) process gas connections
- Up to four (4) process gas connections
User-friendly plasma cleaning systems provide higher yields and repeatable results.
- Removes thick layers of photoresist or polyimide quickly (up to 6,000-7,000 Å/min)
- Applications range from aggressive strip processes to gentle descum and surface modification
- Downstream process balances plasma charge and protects against damaging UV exposure
- Precise temperature control for uniform, repeatable results Up to four (4) process gas connections
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EcoClean
Small footprint system provides automated plasma strip/descum with low cost of ownership.
- Single wafer automated process with extremely small footprint (0.74m²)
- Handles wafers from 50mm to 200mm
- High strip rate: 100-100,000 Å/min (0.01 – 10 μm/min)
- High throughput of up to 65 wph with robotic handler
- Eco-friendly “green” process with low gas usage
- ICP downstream plasma prevents substrate damage
- High reliability (only three moving parts)
Small footprint system provides automated plasma strip/descum with low cost of ownership.
- Single wafer automated process with extremely small footprint (0.74m²)
- Handles wafers from 50mm to 200mm
- High strip rate: 100-100,000 Å/min (0.01 – 10 μm/min)
- High throughput of up to 65 wph with robotic handler
- Eco-friendly “green” process with low gas usage
- ICP downstream plasma prevents substrate damage
- High reliability (only three moving parts)
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G Series
Parallel capacitive 1000W plasma system provides manual, gentle molecular level curing.
- Effective replacement for toxic chemicals
- Leaves no solvent residues on surfaces
- Five (5) plasma modes with single or dual plasma configuration
- – Mild anisotropic: downstream (electron free), active and RIE (Reactive Ion Etching)
- – Isotropic: active ion trap, downstream ion trap
- Any mixture of up to 3 gas inputs (O₂, Ar or N₂ plasma)
- 40kHz and 13.56MHz available
- Four 406mm x 406mm standard sample trays (1651.6 cm²)
Parallel capacitive 1000W plasma system provides manual, gentle molecular level curing.
- Effective replacement for toxic chemicals
- Leaves no solvent residues on surfaces
- Five (5) plasma modes with single or dual plasma configuration
- – Mild anisotropic: downstream (electron free), active and RIE (Reactive Ion Etching)
- – Isotropic: active ion trap, downstream ion trap
- Any mixture of up to 3 gas inputs (O₂, Ar or N₂ plasma)
- 40kHz and 13.56MHz available
- Four 406mm x 406mm standard sample trays (1651.6 cm²)
Coat Systems- Choose among 100+ chemical precursors
- Achieve up to 3X improvement in temperature uniformity over our competition
- Leverage YES expertise and proven history in deploying thousands of systems across various emerging industries
- Surface modification
(adhesion / hydrophobic / hydrophilic) - Adhesion improvement
- Anti-stiction layer
- Surface priming for microarrays
- DNA sequencing and microfluidics
- Self-assembled monolayer deposition
and removal - Seed layer for metallization
Flexible Silane Monolayer Deposition/Prime System with Plasma
- Excellent control of process parameters yielding very stable processes with minimal chemical usage
- Scalable to volume production
- >100 chemical processes developed from organosilanes, PEG and biotin functional compounds
- 40KHz or 13.56MHz plasma pre-cure
Flexible Silane Monolayer Deposition/Prime System with Plasma
- Excellent control of process parameters yielding very stable processes with minimal chemical usage
- Scalable to volume production
- >100 chemical processes developed from organosilanes, PEG and biotin functional compounds
- 40KHz or 13.56MHz plasma pre-coat
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EcoCoat
Flexible Silane Monolayer Deposition/Prime System with Plasma
- Excellent control of process parameters yielding very stable processes with minimal chemical usage
- Scalable to volume production
- >100 chemical processes developed from organosilanes, PEG and biotin functional compounds
- 40KHz or 13.56MHz plasma pre-cure
Flexible Silane Monolayer Deposition/Prime System with Plasma
- Excellent control of process parameters yielding very stable processes with minimal chemical usage
- Scalable to volume production
- >100 chemical processes developed from organosilanes, PEG and biotin functional compounds
- 40KHz or 13.56MHz plasma pre-coat
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UltraCoat™
Automated Silane Monolayer Deposition System
- High throughput, low CoO solution for automated processing of 50-100 wafers
- Handles both 200mm and 300mm wafers
- Coating temperatures up to 250°C with ≤1.5% temp uniformity and multi-zone contro
- Up to 5 vaporization lines with precision mass flow and thermal control
- Remote downstream plasma generator removes organic residues from chamber
Automated Silane Monolayer Deposition System
- High throughput, low CoO solution for automated processing of 50-100 wafers
- Handles both 200mm and 300mm wafers
- Coating temperatures up to 250°C with ≤1.5% temp uniformity and multi-zone contro
- Up to 5 vaporization lines with precision mass flow and thermal control
- Remote downstream plasma generator removes organic residues from chamber
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TA Series
YES-58TA HMDS Vacuum Cure/Vapor Prime System
- Fast, uniform, cost-effective priming of wafer surfaces with hexamethyldisilizane (HMDS) to improve photoresist adhesion
- Vacuum cure dehydrates wafers thoroughly for a superior bond
- HMDS layer remains stable even after weeks of exposure to atmospheric moisture
- Advanced control systems offer user-selectable temperature, process time and chamber size
- Lower chemical consumption and chemical cost
YES-58TA HMDS Vacuum Cure/Vapor Prime System
- Fast, uniform, cost-effective priming of wafer surfaces with hexamethyldisilizane (HMDS) to improve photoresist adhesion
- Vacuum cure dehydrates wafers thoroughly for a superior bond
- HMDS layer remains stable even after weeks of exposure to atmospheric moisture
- Advanced control systems offer user-selectable temperature, process time and chamber size
- Lower chemical consumption and chemical cost
Cure Systems- Achieve up to 50% improvement in cure time
- Cut total cost of ownership (TCO) in half
- Improve the performance of products with less outgassing, greater film stability, and higher reliability
- Polyimide, BCB or PBO cure
- Wafer-to-wafer bonding anneal
- Vacuum anneal up to 400°C
- Pre-metal or pre-PVD bake and degas
Manual Load High-Temperature Vacuum Cure Systems
- Faster process: 3.5 hours vs 8+ hours
- Laminar flow reduces/eliminates particles
- More complete cure (5x less outgassing)
- Less film stress and low wafer warpage
- 1.6x to 2x less power and N2 consumption
- Much lower capital cost, 2-3x lower CoO
Manual Load High-Temperature Vacuum Cure Systems
- Faster process: 3.5 hours vs 8+ hours
- Laminar flow reduces/eliminates particles
- More complete cure (5x less outgassing)
- Less film stress and low wafer warpage
- 1.6x to 2x less power and N2 consumption
- Much lower capital cost, 2-3x lower CoO
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PB Series
Manual Load High-Temperature Vacuum Cure Systems
- Faster process: 3.5 hours vs 8+ hours
- Laminar flow reduces/eliminates particles
- More complete cure (5x less outgassing)
- Less film stress and low wafer warpage
- 1.6x to 2x less power and N2 consumption
- Much lower capital cost, 2-3x lower CoO
Manual Load High-Temperature Vacuum Cure Systems
- Faster process: 3.5 hours vs 8+ hours
- Laminar flow reduces/eliminates particles
- More complete cure (5x less outgassing)
- Less film stress and low wafer warpage
- 1.6x to 2x less power and N2 consumption
- Much lower capital cost, 2-3x lower CoO
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VertaCure XP G2
Automated Vacuum Cure System for Polyimide/BCB/PBO/Low Temp Polymers
- 5 hours vs. 8+ hours for atmospheric cure
- Laminar flow reduces/eliminates particles
- More complete cure (5x less outgassing) with less film stress, low wafer warpage, and reduced thermal budget
- Optimized heating provides superior WiW and WtW temperature uniformity
- HVM-validated filtration solution extends PM interval to 8000+ wafers
- 6x to 2x less power and N₂ consumption
- Much lower capital cost, 2-3x lower CoO
Automated Vacuum Cure System for Polyimide/BCB/PBO/Low Temp Polymers
- 5 hours vs. 8+ hours for atmospheric cure
- Laminar flow reduces/eliminates particles
- More complete cure (5x less outgassing) with less film stress, low wafer warpage, and reduced thermal budget
- Optimized heating provides superior WiW and WtW temperature uniformity
- HVM-validated filtration solution extends PM interval to 8000+ wafers
- 6x to 2x less power and N₂ consumption
- Much lower capital cost, 2-3x lower CoO
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VertaCure PLP
Automated Vacuum Cure System for Panel Cure/Anneal
- Proven hardware with superior process results
- Accommodates panel dimensions from 400mm to 550mm
- Two process modules, each holding twelve panels
- Supports PI/PBO cure, D2P bonding, pre-metal degas and low-temp processing
- Vertical batch processing with laminar flow for excellent particle performance
- Active heating and cooling for rapid ramp-up and ramp-down
- Automated loading and unloading using EFEM
Automated Vacuum Cure System for Panel Cure/Anneal
- Proven hardware with superior process results
- Accommodates panel dimensions from 400mm to 550mm
- Two process modules, each holding twelve panels
- Supports PI/PBO cure, D2P bonding, pre-metal degas and low-temp processing
- Vertical batch processing with laminar flow for excellent particle performance
- Active heating and cooling for rapid ramp-up and ramp-down
- Automated loading and unloading using EFEM
Bond- Repeatable, controllable results in high volume manufacturing
- Complete bonding with excellent reliability
- Excellent particle performance
- 3D packaging
- CMOS image sensors under panel
- Polyimide bake
- Copper anneal
- Wafer-to-wafer bonding annea
- DtP and PtP bonding
Ensure complete, reliable and void-free wafer and panel bonding in less time with a reduced thermal budget. Achieve superior bond strength and particle performance with excellent temperature uniformity. Key benefits include:
- Void-free hybrid bonding in less time and at lower temperatures
- Vacuum anneal provides Cu-Cu bonding without voids, delamination or dishing
- Laminar flow reduces/eliminates particles
- Bonding strength increases 3-4.5x under vacuum at temperatures as low as 200°C or 300°C compared to atmospheric anneal
- Vacuum anneal enables 6 μm pitch with no voids or bubbles
- Less film stress and low wafer warpage
Perform low-temp direct bonding and high-temp vacuum annealing with a single production-proven system. Ensure consistent high reliability for demanding 3D stacking and heterogeneous integration applications in high bandwidth memory and other critical areas.
- Repeatable, controllable results in high volume manufacturing
- Complete bonding with excellent reliability
- Excellent particle performance
ReflowProven subsystems and YES’s four decades of vacuum technology expertise come together in this low-maintenance, small-footprint system that saves on floor space, chemical consumption, production time, and overall ownership cost.
Wet ProcessYES offers flexible, configurable automated and manual wet process platforms for a wide range of substrate materials (silicon, glass, SiC, sapphire, GaAs, GaN, Ge, GeN, InP, niobium) and shapes ranging from 150mm, 200mm and 300mm wafers to panels, polysilicon chunks, ingots and medical devices.
Wet processes possible with YES equipment include etch (metal, oxide, nitride, silicon, polysilicon), clean (wafer reclaim, particle removal, poly chunk, critical clean, photomask clean, FEOL, BEOL), strip (photoresist, Ti, nitride), removal (polymer, metal, resist, flux, reclaim, liftoff), extraction (solvents and aqueous), electroless plating (Cu, Ni, Pd, Co, ENEPIG), electrochemical deposition (Cu, Au, Ni, Sn, Co, alloys, Pb-free solder), texturization (damage repair, SAP based metal cleaning, roughening), drying (surface tension gradient, IPA vapor, hot DI slow pull, SRD), chemical delivery (wet bench, fume hood, aqueous, solvent), desmear, and coating.
- Electroless & Electrolytic Plating
- Wet Clean/Etch
- SC1,SC2, Pre-Diffusion Clean
- Metal Etch
- Resist Strip
- Polysilicon Chunk Clean
Suffix delivers the industry’s best autocatalytic plating performance, with constant plating thickness across substrates as large as 510×515 mm, and maximum batch throughput. Its flexible, modular design allows for streamlined installation and precise configuration to customer needs
- Manual or automatic loading
- Exclusive laminar flow technology for uniform solution flow and even temperature distribution
- Unique 4-side overflow removes surface contamination
- Airflow management system controls particulates and captures fumes
- Online live monitoring and remote system control
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Suffix Electroless Plating System
Ensure complete, reliable and void-free wafer and panel bonding in less time with a reduced thermal budget. Achieve superior bond strength and particle performance with excellent temperature uniformity. Key benefits include:
- Void-free hybrid bonding in less time and at lower temperatures
- Vacuum anneal provides Cu-Cu bonding without voids, delamination or dishing
- Laminar flow reduces/eliminates particles
- Bonding strength increases 3-4.5x under vacuum at temperatures as low as 200°C or 300°C compared to atmospheric anneal
- Vacuum anneal enables 6 μm pitch with no voids or bubbles
- Less film stress and low wafer warpage
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Automated Linear Transfer (ALT)
The versatile, modular ALT system is the result of years of wet processing experience unmatched in the industry. It is a proven and trusted choice for a wide range of in-line processes – from SC1, SC2, and pre-diffusion cleans to metal etch, acidic processes, and resist strip.
- Manual, semi-automatic or automatic loading
- Modular, flexible transport system
- Excellent particle mitigation
- Dedicated drains for fluoride wastes or precious metal reclaim
The versatile, modular ALT system is the result of years of wet processing experience unmatched in the industry. It is a proven and trusted choice for a wide range of in-line processes – from SC1, SC2, and pre-diffusion cleans to metal etch, acidic processes, and resist strip.
- Manual, semi-automatic or automatic loading
- Modular, flexible transport system
- Excellent particle mitigation
- Dedicated drains for fluoride wastes or precious metal reclaim
YES offers a complete portfolio of cassettes and software for YES Clean, Coat, and Cure systems. You may also order customized cassettes and additional replacement parts for YES systems.
Other Parts, Accessories, and Software
Contact us to order replacement door seals and optional parts for your YES equipment.