WHITE PAPERS
Read papers authored by YES engineering and scientific leaders about implementing YES equipment, services, and solutions to modify surfaces, materials, and interfaces for applications in the life sciences (i.e., genomics and medical devices), emerging technologies, advanced packaging (semiconductors), and other industries.
YES’s Solutions for DNA Sequencing, Genomics and Microfluidic Devices
Learn why 70% of the world’s genome sequencing is done on equipment using YES technology. With the advent of next-generation sequencing (NGS), genomics companies can greatly benefit from the speed and cost-efficiency improvements and innovation across process, materials, and machine miniaturization that YES systems provide.
YES’s Surface Modification Solutions for the Medical Device Industry
Take a tour of the YES portfolio of equipment, services, and solutions to modify materials, surfaces, and interfaces for optics and medical devices. Gain insight into how patented YES processes to modify surfaces or create new materials for medical devices is helping companies achieve groundbreaking throughput and cost efficiency.
YES HMDS Vapor Prime Process Application Note
In this paper, learn about HMDS vapor priming and why it is safer and less expensive than spin-dispensed HMDS priming. We compare our HMDS vapor prime process versus an SVG Coater Track as studied at UC Berkeley’s Marvell Nano Lab; we also present and summarize the results from statistically designed experiments (DOE’s) conducted at the Univ. of Texas – Dallas.
Solutions for Nano and Micro-Structured Optical Films
Many emerging thin-film optical technologies have fabrication requirements that fall outside the capabilities of conventional PVD and CVD tools and methods. One such emerging technology is metasurface optics. In this paper, learn about YES equipment and high volume manufacturing (HVM) solutions for imprint lithography that generates the highest fidelity.
Improvements in the Reliability, Costs and Processing of WLP/RDL Circuits
Wafer-level Packaging (WLP) and Redistribution Layers (RDL) circuits must incorporate multiple polyimide layers. In this paper, see the difference between curing polyimide film under atmospheric versus vacuum process conditions. YES vacuum curing processes are shown to significantly reduce process time and provide a larger process window with many advantages.
ABSTRACT : Better Thermal, Mechanical and Physical Properties of Cured Polymer Using Low Pressure Vacuum Cure Processing Circuits
Mechanical, thermal, physical and dielectric properties were evaluated for different types of polyimide and PBO materials using the YES VertaCure vacuum cure system, as compared to the atmospheric process.