Read papers authored by YES engineering and scientific leaders about implementing YES equipment, services, and solutions to modify surfaces, materials, and interfaces for applications in the life sciences (i.e., genomics and medical devices), emerging technologies, advanced packaging (semiconductors), and other industries.
Low-temperature polyimide processing for next-gen backend applications (Article in Chip Scale Review July/Aug 2021)
The thermal, mechanical, and dielectric properties of polyimide materials are critical to meeting the demands of fan-out or wafer-level processing for 3D stacking applications. The team at YES worked together with colleagues at Hitachi Dupont (Melvin Zussman and Ron Legario) as well as colleagues at Fuji to study those properties for various low-temperature polyimides as a function of different process parameters under atmospheric and vacuum process conditions.
YES’s Solutions for DNA Sequencing, Genomics and Microfluidic Devices
Learn why 70% of the world’s genome sequencing is done on equipment using YES technology. With the advent of next-generation sequencing (NGS), genomics companies can greatly benefit from the speed and cost-efficiency improvements and innovation across process, materials, and machine miniaturization that YES systems provide.
Solutions for Nano and Micro-Structured Optical Films
Many emerging thin-film optical technologies have fabrication requirements that fall outside the capabilities of conventional PVD and CVD tools and methods. One such emerging technology is metasurface optics. In this paper, learn about YES equipment and high volume manufacturing (HVM) solutions for imprint lithography that generates the highest fidelity.
Answers for Today’s Packaging Needs (cover article in Silicon Semiconductor (Volume 38, Issue 3)
Creating smaller packaged IC devices with more input and output connections led to the creation of wafer-level packaging (WLP). Yield Engineering Systems details the benefits of vacuum cure processing for fan out wafer-level packaging.
e=mc3 a review of copper annealing processes and equipment
In any robust microcircuit manufacturing environment, processes and equipment have to be decided on quickly, often too quickly for all the factors influencing the decision to be properly analyzed. Copper annealing is an example. This paper explores the process, physical and economic parameters that govern engineering decisions to purchase a copper annealer.
Effect of Surface Free Energy on PDMS Transfer in Microcontact Printing and Its Application to ToF-SIMS to Probe Surface Energies
We show that PDMS transfer can be applied as a probe of surface free energies using ToF-SIMS, where PDMS preferentially transfers onto more hydrophilic surface features during stamping, with little being transferred onto very hydrophobic surface features. Multivariate curve resolution (MCR) analysis of the ToF-SIMS image data further confirms and clarifies these results. Our data lend themselves to the hypothesis that it is the free energy of the surface that plays a major role in determining the degree of PDMS transfer during μCP.
Characterization of Thin Films and Materials: An Introduction to Silanes, their Chemical Vapor Deposition onto Si/SiO2, and Characterization of the Resulting Monolayers
Silanes are arguably the most important and diverse class of surface modification reagents. Many hundreds of different silanes are commercially available that can be used to tailor surface properties in a myriad of ways. The two most important ways for depositing silanes are by either liquid or gas phase deposition. Learn why the gas phase approach can be much more reproducible, and it is automatable: the chemical vapor deposition of silanes avoids some of the chemical uncertainty associated with solution deposition.
Subsurface Oxidation for Micropatterning Silicon (SOMS)
Surface patterning on silicon is critically important in research and industry. In silicon semiconductor manufacturing, it is central to microchip fabrication. Learn about a simple, straightforward tool for patterning silicon based on plasma oxidation through a stencil mask. We term this method: Subsurface Oxidation for Micropatterning Silicon (SOMS).
A Two-Silane Chemical Vapor Deposition (CVD) Treatment of Polymer (Nylon) and Oxide Surfaces that Yields Hydrophobic(and Superhydrophobic), Abrasion-Resistant Thin Films
This paper describes a two-silane, chemical vapor deposition (CVD) approach to creating hydrophobic (or even superhydrophobic), abrasion resistant coatings on silicon oxide and polymer (nylon) substrates. See how the entire deposition process is conducted cost-efficiently with YES plasma/CVD systems.
Chemical Vapor Deposition of Three Aminosilanes on Silicon Dioxide: Surface Characterization, Stability, Effects of Silane Concentration, and Cyanine Dye Adsorption
Explore the conditions for preparing controlled, ultrathin aminosilane films on silicon substrates. This study determines the gas phase concentration of silane that is needed to saturate the surface of a silicon oxide surface. Learn how to produce chromatographic stationary phases with improved stability.
YES’s Surface Modification Solutions for the Medical Device Industry
Take a tour of the YES portfolio of equipment, services, and solutions to modify materials, surfaces, and interfaces for optics and medical devices. Gain insight into how patented YES processes to modify surfaces or create new materials for medical devices is helping companies achieve groundbreaking throughput and cost efficiency.
YES HMDS Vapor Prime Process Application Note
In this paper, learn about HMDS vapor priming and why it is safer and less expensive than spin-dispensed HMDS priming. We compare our HMDS vapor prime process versus an SVG Coater Track as studied at UC Berkeley’s Marvell Nano Lab; we also present and summarize the results from statistically designed experiments (DOE’s) conducted at the Univ. of Texas – Dallas.
Improvements in the Reliability, Costs and Processing of WLP/RDL Circuits
Wafer-level Packaging (WLP) and Redistribution Layers (RDL) circuits must incorporate multiple polyimide layers. In this paper, see the difference between curing polyimide film under atmospheric versus vacuum process conditions. YES vacuum curing processes are shown to significantly reduce process time and provide a larger process window with many advantages.
ABSTRACT : Better Thermal, Mechanical and Dielectric Properties of Cured Polyimides Using Low Pressure Vacuum Cure Processing
Mechanical, thermal, physical and dielectric properties were evaluated for different types of polyimide and PBO materials using the YES VertaCure vacuum cure system, as compared to the atmospheric process.
Cure Process Impact On Cure Time and Properties of Low Temperature Polyimide for 3D Stacking Applications
Zia Karim, Ph.D of Yield Engineering Systems (YES) analyzes the usage of low temperature polyimide material as a function of cure parameters at a cure temperature of ~200°C under atmospheric and sub-atmospheric process conditions. Vacuum cure of low temperature polyimide appears to improve the outgassing properties and dielectric strength at lower pressure.