The thermal, mechanical, and dielectric properties of polyimide materials are critical to meeting the demands of fan-out or wafer-level processing for 3D stacking applications. The team at YES worked together with colleagues at Hitachi Dupont (Melvin Zussman and Ron Legario) as well as colleagues at Fuji to study those properties for various low-temperature polyimides as a function of different process parameters under atmospheric and vacuum process conditions.

Learn why 70% of the world’s genome sequencing is done on equipment using YES technology. With the advent of next-generation sequencing (NGS), genomics companies can greatly benefit from the speed and cost-efficiency improvements and innovation across process, materials, and machine miniaturization that YES systems provide.

Many emerging thin-film optical technologies have fabrication requirements that fall outside the capabilities of conventional PVD and CVD tools and methods. One such emerging technology is metasurface optics. In this paper, learn about YES equipment and high volume manufacturing (HVM) solutions for imprint lithography that generates the highest fidelity.

Creating smaller packaged IC devices with more input and output connections led to the creation of wafer-level packaging (WLP). Yield Engineering Systems details the benefits of vacuum cure processing for fan out wafer-level packaging.

In any robust microcircuit manufacturing environment, processes and equipment have to be decided on quickly, often too quickly for all the factors influencing the decision to be properly analyzed. Copper annealing is an example. This paper explores the process, physical and economic parameters that govern engineering decisions to purchase a copper annealer.

We show that PDMS transfer can be applied as a probe of surface free energies using ToF-SIMS, where PDMS preferentially transfers onto more hydrophilic surface features during stamping, with little being transferred onto very hydrophobic surface features. Multivariate curve resolution (MCR) analysis of the ToF-SIMS image data further confirms and clarifies these results. Our data lend themselves to the hypothesis that it is the free energy of the surface that plays a major role in determining the degree of PDMS transfer during μCP.

Silanes are arguably the most important and diverse class of surface modification reagents. Many hundreds of different silanes are commercially available that can be used to tailor surface properties in a myriad of ways. The two most important ways for depositing silanes are by either liquid or gas phase deposition. Learn why the gas phase approach can be much more reproducible, and it is automatable: the chemical vapor deposition of silanes avoids some of the chemical uncertainty associated with solution deposition.

Surface patterning on silicon is critically important in research and industry. In silicon semiconductor manufacturing, it is central to microchip fabrication. Learn about a simple, straightforward tool for patterning silicon based on plasma oxidation through a stencil mask. We term this method: Subsurface Oxidation for Micropatterning Silicon (SOMS).

Take a tour of the YES portfolio of equipment, services, and solutions to modify materials, surfaces, and interfaces for optics and medical devices. Gain insight into how patented YES processes to modify surfaces or create new materials for medical devices is helping companies achieve groundbreaking throughput and cost efficiency.

Wafer-level Packaging (WLP) and Redistribution Layers (RDL) circuits must incorporate multiple polyimide layers. In this paper, see the difference between curing polyimide film under atmospheric versus vacuum process conditions. YES vacuum curing processes are shown to significantly reduce process time and provide a larger process window with many advantages.

Mechanical, thermal, physical and dielectric properties were evaluated for different types of polyimide and PBO materials using the YES VertaCure vacuum cure system, as compared to the atmospheric process.