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YES Delivers Multiple VertaCure XP Systems
FREMONT, CALIFORNIA, UNITED STATES, September 3, 2024 /EINPresswire.com/ — Yield Engineering Systems (YES) is a leading manufacturer of process equipment for AI and HPC semiconductor solutions. YES announced today that it has delivered multiple VertaCure XP curing systems to a leading Semiconductor manufacturer. These systems will be utilized in the manufacturing of advanced packaging of AI and HPC solutions, where they will support low temperature curing for multiple RDL layers of 2.5D/3D packaging.
YES signs MoU with Tamil Nadu Government
FREMONT, CALIFORNIA, UNITED STATES, August 30, 2024 /EINPresswire.com/ — Yield Engineering Systems (YES) is a leading manufacturer of process equipment for AI and HPC semiconductor solutions. YES announced today that it has signed a Memorandum of Understanding (MoU) with Government of Tamil Nadu. As part of the MoU, YES has proposed to set up a manufacturing and New Product development facility in Coimbatore, India.
YES Delivers Multiple EcoCoat Systems
FREMONT, CALIFORNIA, UNITED STATES, August 13, 2024 /EINPresswire.com/ — Yield Engineering Systems (YES) is a leading manufacturer of process equipment for AI and HPC semiconductor solutions as well as life sciences and biomedical applications. YES announced today that it has delivered multiple EcoCoat Vapor Deposition systems to a leading Diagnostic Testing customer. These systems will be utilized in the manufacturing of test platforms for Molecular Diagnostic Testing and PCR for DNA/RNA amplification.
YES Panel-Level Through Glass Via (TGV) Etch Tool Placed in Production
FREMONT, CALIFORNIA, UNITED STATES, July 2, 2024 /EINPresswire.com/ — YES, a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and AR/VR applications, today announced that Its TersOnus TGV tool was released for panel-level manufacturing. This system will be used to support the growth of advanced heterogeneous packaging for artificial intelligence chips that enable large language models.
YES Delivers Multiple VeroTherm Formic Acid Reflow Systems To Leading Semiconductor Device Customers
FREMONT, CALIFORNIA, UNITED STATES, June 26, 2024 /EINPresswire.com/ — YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging applications, today announced that it has delivered multiple VeroTherm Formic Acid Reflow (FAR) systems to leading logic and memory customers.
Nirmalya Maity Joins YES as Chief Strategy Officer
FREMONT, CALIFORNIA, UNITED STATES, March 12, 2024 /EINPresswire.com/ — Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, announced that Nirmalya Maity has joined the company as its Chief Strategy Officer.
YES Secures VertaCure™ XP Volume Purchase Order from Tier 1 Taiwanese OSAT
FREMONT, CALIFORNIA, UNITED STATES, December 12, 2023 /EINPresswire.com/ — Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications,, today announced that it has received a volume purchase order for the VertaCure™ XP from a Taiwan-based OSAT. The systems, which will be utilized for gold bumping and wafer-level-packaging in high volume manufacturing, will be delivered within the next 6 months to address growing production demands.
Michael Daly Joins YES as SVP and GM of Wet Processing Systems
FREMONT , CALIFORNIA, UNITED STATES, November 8, 2023 /EINPresswire.com/ — Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, announced that Michael Daly has joined the company as its Senior Vice President and General Manager of Wet Processing Systems.
YES TersOnus™ Continues To Gain Momentum In Silicon Carbide Ecosystem
FREMONT, CALIFORNIA, UNITED STATES, October 3, 2023 /EINPresswire.com/ — Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor, life sciences, and “More-than-Moore” applications, today announced that it had sold multiple Wet Processing Systems to a premier Silicon Carbide (SiC) materials manufacturer. The adoption of SiC Wide Band Gap (WBG) semiconductors continues to grow with demand driven by Electric Vehicle (EV) production and charging infrastructure, power supply systems, and Photovoltaic (PV) inverters.
Yield Engineering Systems Opens New Advanced Technology Center in Arizona to Support Semiconductor Growth in the US
CHANDLER, AZ, USA, July 27, 2023/EINPresswire.com/ — Yield Engineering Systems (YES), a leading provider
of technology solutions and process equipment for the semiconductor ecosystem and applications, held a
ribbon-cutting ceremony today for its new 123,000-square-foot facility in Chandler, Arizona. The
facility is located at 3200 W. Germann Road within the Price Corridor employment center.
The
state-of-the-art YES Advanced Technology Center (YATC) will include 50,000-square-feet of manufacturing
space for unparalleled semiconductor manufacturing and process development.
YES & Global Zeus Announce Strategic Partnership to Introduce Cutting-Edge Single Wafer Processing Technology to the US
FREMONT, CALIFORNIA, UNITED STATES, July 10, 2023 — Yield Engineering Systems (YES), a leading provider
of technology solutions and process equipment for the Semiconductor Ecosystem and “More-than-Moore”
applications, today announced a strategic partnership with Global Zeus, a renowned provider of advanced
semiconductor processing solutions.
The partnership aims to bring Global Zeus’ cutting-edge single
wafer processing technology to the US market through YES’s extensive sales and distribution network.
Yield Engineering Systems (“YES”) Announces $55M Debt Financing from the Aon IP Advantage Fund
FREMONT, CALIFORNIA, UNITED STATES, June 14, 2023 — YES, a leading provider of technology solutions and
process equipment for the Semiconductor Ecosystem and “More-than-Moore” applications, today announced
$55 million in growth credit financing from a fund managed by Aon Advantage Funds LLC, with support from
services provided by Aon’s IP Solutions.
Global professional services firm Aon leverages the deep
know-how of its 200+ person team, as well as capital provided by funds managed by Aon Advantage Funds
LLC, providing low-dilution growth capital at scale to IP-rich businesses.
Laxman (Lucky) Murugesh Joins YES as SVP and GM of Dry Products
FREMONT, CALIFORNIA, UNITED STATES, June 6, 2023 — Yield Engineering Systems, Inc. (YES), a leading
manufacturer of process equipment for semiconductor advanced packaging, life sciences, and
“More-than-Moore” applications, today announced that Laxman (Lucky) Murugesh has joined the company as
its Senior Vice President and General Manager of Dry Products.
Dr. Murugesh assumes overall
responsibility for enhancing the market share and profitability of YES’s rapidly-growing Dry Products
business unit, and will manage its existing product lines as well as new product development.
YES Promotes Chris Lane to Senior Vice President, Central Engineering
FREMONT, CALIFORNIA, UNITED STATES, May 23, 2023 — Yield Engineering Systems, Inc. (YES), a leading
manufacturer of process equipment for semiconductor advanced packaging, life sciences, and
“More-than-Moore” applications, today announced that Chris Lane has been promoted to Senior Vice
President, Central Engineering.
Mr. Lane joined the company in August of 2020 as its Vice President
of Engineering. This promotion recognizes his accomplishments in building a cohesive product engineering
organization across a growing number of YES engineering centers worldwide.
Yield Engineering Systems Names Prabhat Mishra as Chief Financial Officer
FREMONT, CALIFORNIA, UNITED STATES, May 16, 2023 — Yield Engineering Systems, Inc. (YES), a leading
manufacturer of process equipment for semiconductor advanced packaging, life sciences, and
“More-than-Moore” applications, today announced that Prabhat Mishra has been promoted to Chief Financial
Officer, with overall responsibility for Finance, Legal & Compliance, People & Culture,
Facilities & Infrastructure, and IT.
“Prabhat’s Financial, Accounting and Business Strategy
talents have proven invaluable as YES has evolved rapidly from small-scale supplier to global
manufacturer for the world’s largest technology companies,” said Ramakanth Alapati, CEO and Chairman of
YES.
Leading Korean OSAT Purchases YES VertaCure™ XP for Higher Yield and Performance
FREMONT, Calif. – Jan 23, 2023 – Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, today announced that it has sold a VertaCure XP G2 system to Korea’s LB Semicon. The VertaCure XP G2 is the latest generation of YES’s flagship VertaCure vacuum curing system, and LB Semicon’s will be the first such system to be installed in Korea. Delivery is expected at the end of March.
YC Wong Joins YES as VP of Business Development, Asia Pacific
FREMONT, Calif. – December 12, 2022 – Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, today announced that Yee Ching (YC) Wong has joined the company’s senior leadership team as Vice President of Business Development for the Asia Pacific region.
Russ Sanchez Joins YES as VP of Quality and Managing Director of YES Technology Center
FREMONT, Calif. – July 18, 2022 – Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, today announced that Russ Sanchez has joined the company’s senior leadership team as Vice President of Quality and Managing Director of YES’s new Technology Center in Chandler, Arizona.
YES Names Dan O’Connell as Vice President of Strategic Accounts
FREMONT, Calif. – July 6, 2022 – Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, today announced that it has promoted Dan O’Connell to Vice President of Strategic Accounts.
Yield Engineering Systems Signs Lease for Technology Center in Chandler
CHANDLER, Arizona – June 1, 2022 – Yield Engineering Systems, known by the acronym YES, has leased 123,000 square feet within the Price Corridor in Chandler, Arizona. The facility will support YES in serving the region’s thriving semiconductor industry.
YES Joins Forces with Korea’s H&iruja for Manufacturing and Distribution
FREMONT, Calif. – May 2, 2022 – YES today announced that it has executed a manufacturing and distribution agreement with H&iruja to address Korea’s advanced packaging market opportunities.
YES Establishes Engineering, Design and Sales Presence in India
FREMONT, Calif. – Feb 8, 2022 – YES today announced that it has set up Engineering Centers of Excellence at two locations in India: Coimbatore and Bangalore.
Victor Huang Joins Yield Engineering Systems (YES) as VP of Legal Affairs
FREMONT, Calif. – Jan 13, 2022 – YES today announced that Victor Huang has joined the company as its first Vice President of Legal Affairs.
YES (Yield Engineering Systems, Inc.) Acquires SPEC (Semiconductor Process Equipment Corp.)
FREMONT, Calif. – Dec 21, 2021 – YES today announced that it has acquired SPEC (Semiconductor Process Equipment Corporation) of Valencia, California for an undisclosed amount.
YES Announces Strategic Partnership with Osiris for Edge Film Removal Technology
October 26, 2021 – YES today announced that it has signed an exclusive agreement with Osiris (Osiris International GmbH) to license its smartEBR technology for edge bead removal on panels.
Guy Shechter Joins YES as VP of Global Product Management and Global Service
October 19, 2021 – YES announced that Guy Shechter has joined the company as its new Vice President of Global Product Management and Global Service.
YES Acquires Kanthal’s Semiconductor Capital Equipment Business
October 7, 2021 – YES announced that it has purchased the semiconductor equipment business of Swedish heating technology provider Kanthal.
Kimihiko Matsubara Selected as General Manager of YES Japan
September 22, 2021 – YES announced that Kimihiko Matsubara has joined its senior management team and will lead its sales efforts in the Japan market.
Bioh Kim Joins YES as President of YES Korea
August 23, 2021 – YES today announced that Bioh Kim has joined its management team as President of YES Korea.
YES Delivers First VertaCure™ XP to Leading Chinese OSAT Customer
August 9, 2021 – YES today announced its first shipment of the VertaCure™ XP vacuum curing system to a China-based OSAT customer.
YES EcoCoat™ HVM to Help Customer Fulfill Large NIH Contract for Rapid COVID Antibody Testing Devices
July 26, 2021 – YES today announced that one of its customers has been awarded a multimillion-dollar contract by the US’s National Institutes of Health to manufacture a new COVID testing device for mass distribution.
Don Foldenauer Joins YES as Vice President of Operations
July 19, 2021 – YES today announced that Don Foldenauer is the company’s new VP of Operations.
Prabhat Mishra Promoted to Vice President of Finance at YES
June 28, 2021 – YES today announced that Prabhat Mishra will be the company’s new Vice President of Finance.
Yield Engineering Systems, Inc. (YES) Joins Silicon Saxony High-Tech Network
June 14, 2021 – YES today announced that it has become a member of the Silicon Saxony industry association.
YES (Yield Engineering Systems, Inc.) and SPEC (Semiconductor Process Equipment Corp.) Sign Strategic Alliance Agreement
June 1, 2021 – YES today announced a strategic alliance with SPEC (Semiconductor Process Equipment Corporation) of Valencia, California.
YES Joins Forces with EV Group
April 19, 2021 – YES today announced it is working with EV Group and will install a YES EcoCoat™ monolayer coating system at EVG’s NILPhotonics® Competence Center in Austria.
Winstek Places Second Order for YES VertaCure™ XP
April 5, 2021 – YES today announced that it will deliver another VertaCure™ XP, the latest version of its flagship VertaCure vacuum curing system, to Winstek Semiconductor Co., Ltd., one of the leading testing and bump houses in Taiwan.
YES Secures VertaCure™ XP Volume Purchase Order from Powertech Technology Inc.
March 30, 2021 – YES today announced that it has received a volume purchase order for the VertaCure™ XP from Taiwan-based OSAT Powertech Technology, Inc.
YES Receives VertaBond™ Purchase Order from a Tier 1 Memory Manufacturer
Mar 15, 2021 – YES today announced that a leading memory manufacturer has ordered the YES VertaBond system for wafer-to-wafer and die-to-wafer bonding.
Dragan Cekic Joins YES as VP of Sales, Americas & Europe
Feb 16, 2021 – YES today announced that Dragan Cekic, an accomplished semiconductor sales & marketing executive with more than two decades of international business and customer experience, has joined the company as its Vice President of Sales for the Americas and Europe.
YES Receives Repeat, Volume VertaCure Order from Major Foundry
Feb 3, 2021 – YES today announced that it has received a repeat, volume purchase order from a leading foundry for its VertaCure polyimide curing system and its next-generation VertaCure XP system.
YES Adds Deca’s Rapid Cure Technology to its Product Line
Jan 25, 2021 – YES today announced that it has signed an agreement to license Deca Technologies’ Rapid Cure technology.
YES and Scientech Sign Strategic Alliance MOU
Jan 11, 2021 – YES today announced that it has signed an agreement with its Taiwan-based partner Scientech Corporation allowing Scientech to manufacture, market, distribute and support YES products in Taiwan and other Asian markets, including the People’s Republic of China.
Vinod Mahendroo Joins YES as SVP Operations
December 21, 2020 – YES today announced that Vinod Mahendroo has joined the company as its Senior Vice-President of Operations…
YES EcoCoat Chosen to Enable Rapid Point-of-Care Diagnostic Device for COVID-19
December 10, 2020 – YES today announced that a prominent company in the Life Sciences sector has purchased its YES EcoCoat monolayer deposition system…
Alex Chow Joins YES as Asia Sales President & GM
December 07, 2020 – YES today announced that Alex Chow has joined the company as Asia Sales President and General Manager…
YES Partners with Singapore’s Gaia Science
December 03, 2020 – YES today announced that it has signed an agreement with Gaia Science Pte. Ltd of Singapore…
YES Announces New President
November 19, 2020 – YES today announced that it has promoted Rezwan Lateef to President of the company…
YES Signs Partner Agreement with Tesscorn
YES Partners with Link Fab
YES Announces New CEO
August 20, 2020 – YES today announced that Ramakanth Alapati is the company’s new chief executive..
SVP Dr. Zia Karim to Deliver ECTC Paper
May 29, 2020 – Investigators Studied PI Film Outcomes under Various Process Conditions…..