Unique UV plus direct thermal exposure process brings throughput & performance advantages
FREMONT, Calif. – Jan 25, 2021 YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and AR/VR applications, today announced that it has signed an agreement to license Deca Technologies’ Rapid Cure technology. The Deca IP, a combination of UV and direct thermal exposure that significantly lowers curing temperature and process time, will enable YES customers to reduce thermal budgets for the organic and inorganic thin films used in semiconductor front end, packaging and display applications.
“We are extremely pleased to join forces with Deca, an acknowledged leader in the Advanced Packaging field, to enhance our thermal processing portfolio,” said Rezwan Lateef, President of YES. “The addition of Deca’s Rapid Cure technology to our cure capabilities allows YES to address a broader variety of Advanced Packaging applications including low temperature polymer cure, underfill bake, adhesive curing, degas/curing of low-K films, and a variety of new fan-out processes. Ultimately, this partnership will provide our customers with a wider array of thermal processing tools with lower CoO and better reliability to enable next generation products.”
“We are delighted to collaborate with YES’s innovative team to extend Rapid Cure into multiple new product applications,” stated Tim Olson, founder & CEO of Deca. “M-Series™ technology has demonstrated industry leading fan-out performance. Rapid Cure has proven to be an integral part of the process which produces consistently excellent quality and reliability.”
The Rapid Cure process consists of ultraviolet (UV) pre-treatment to provide preliminary cross-linking of the polymer, followed by precisely controlled thermal curing. Rapid Cure provides a significant throughput advantage over conventional curing, while delivering comparable or superior properties.
YES (Yield Engineering Systems, Inc.) is a leading manufacturer of high-tech, cost-effective equipment for transforming surfaces, materials and interfaces. The company’s product lines include vacuum cure ovens, chemical vapor deposition (CVD) systems, and plasma etching tools used for precise surface modification and thin-film coating of semiconductor wafers, semiconductor and MEMS devices, and biodevices. With YES, customers ranging from startups to Fortune 100 companies can create and volume-produce products in a wide range of markets, including Advanced Packaging, MEMS, Augmented Reality/Virtual Reality and Life Sciences. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit www.yieldengineering.com
Deca was born of a passion to transform the way the world builds advanced electronic devices. In their first decade, Deca’s 10X thinking brought to life exciting breakthroughs for leading mobile semiconductor companies including M-Series™ FX fan-out and Adaptive Patterning™. From first-generation applications in traditional semiconductor packaging to the growth of second-generation capabilities for chiplets and heterogeneous integration, Deca’s technologies are emerging new standards, providing key foundational building blocks for the future of the semiconductor industry.
Deca’s world-class investors include Infineon, Qualcomm, ASE, nepes and SunPower, all respected industry leaders that provide Deca with strength and visibility for continuing innovation. For more information, please visit www.thinkdeca.com