FREMONT, Calif. – July 6, 2022 – Yield Engineering Systems, Inc. (YES), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences, and “More-than-Moore” applications, today announced that it has promoted Dan O’Connell to Vice President of Strategic Accounts.
Mr. O’Connell joined YES in November of 2021 as Senior Director of Key Account Management. In his newly expanded role, he will work closely with the company’s Sales, Marketing and Technology teams to nurture strategic customer relationships and ensure YES’s alignment with current and future customer technology requirements.
“Dan’s extensive strategic account experience in the semiconductor industry has contributed to our rapid growth,” said Rezwan Lateef, President of YES. “His proven ability to develop strong industry relationships aimed at enabling technology roadmaps, coupled with his intimate knowledge of Advanced Packaging processes, make Dan a valued addition to our senior leadership team.”
Prior to joining YES, Mr. O’Connell held senior key account management positions of increasing responsibility at ASM Pacific Technology Ltd., Tokyo Electron (TEL), LAM/Novellus, and Ebara. He holds a bachelor’s degree in Chemical Engineering from Worcester Polytechnic Institute.
Yield Engineering Systems, Inc. (YES) is a preferred provider of high-tech, cost-effective equipment for enhancing surfaces and materials. The company’s product lines include thermal processing systems, chemical vapor deposition (CVD) systems, and wet process equipment used for the precise surface modification of semiconductor substrates, semiconductor and MEMS devices, LED displays, and biodevices. Customers ranging from startups to Fortune 100 companies rely on YES systems to create and volume-produce innovative products in a wide range of markets. YES is headquartered in Fremont, California, with a growing global presence. For more information, please visit yieldengineering.com.