WHITE PAPERS
Read papers authored by YES engineering and scientific leaders about
implementing YES equipment, services, and solutions to modify surfaces, materials, and interfaces for
applications in the life sciences (i.e., genomics and medical devices), emerging technologies, advanced
packaging (semiconductors), and other industries.
Low-temperature polyimide processing for next-gen backend
applications (Article in Chip Scale Review July/Aug 2021)
The thermal, mechanical, and dielectric properties of polyimide
materials are critical to meeting the demands of fan-out or wafer-level processing for 3D stacking
applications. The team at YES worked together with colleagues at Hitachi Dupont (Melvin Zussman and Ron
Legario) as well as colleagues at Fuji to study those properties for various low-temperature polyimides
as a function of different process parameters under atmospheric and vacuum process conditions.
YES’s Solutions for DNA Sequencing, Genomics and Microfluidic
Devices
Learn why 70% of the world’s genome sequencing is done on
equipment using YES technology. With the advent of next-generation sequencing (NGS), genomics companies
can greatly benefit from the speed and cost-efficiency improvements and innovation across process,
materials, and machine miniaturization that YES systems provide.
Solutions for Nano and Micro-Structured Optical Films
Many emerging thin-film optical technologies have fabrication
requirements that fall outside the capabilities of conventional PVD and CVD tools and methods. One such
emerging technology is metasurface optics. In this paper, learn about YES equipment and high volume
manufacturing (HVM) solutions for imprint lithography that generates the highest fidelity.
Answers for Today’s Packaging Needs (cover article in Silicon
Semiconductor (Volume 38, Issue 3)
Creating smaller packaged IC devices with more input and output
connections led to the creation of wafer-level packaging (WLP). Yield Engineering Systems details the
benefits of vacuum cure processing for fan out wafer-level packaging.
e=mc3 a review of copper annealing processes and equipment
In any robust microcircuit manufacturing environment, processes
and equipment have to be decided on quickly, often too quickly for all the factors influencing the
decision to be properly analyzed. Copper annealing is an example. This paper explores the process,
physical and economic parameters that govern engineering decisions to purchase a copper annealer.
Effect of Surface Free Energy on PDMS Transfer in Microcontact
Printing and Its Application to ToF-SIMS to Probe Surface Energies
We show that PDMS transfer can be applied as a probe of surface
free energies using ToF-SIMS, where PDMS preferentially transfers onto more hydrophilic surface features
during stamping, with little being transferred onto very hydrophobic surface features. Multivariate
curve resolution (MCR) analysis of the ToF-SIMS image data further confirms and clarifies these results.
Our data lend themselves to the hypothesis that it is the free energy of the surface that plays a major
role in determining the degree of PDMS transfer during μCP.
Characterization of Thin Films and Materials: An Introduction to
Silanes, their Chemical Vapor Deposition onto Si/SiO2, and Characterization of the Resulting Monolayers
Silanes are arguably the most important and diverse class of
surface modification reagents. Many hundreds of different silanes are commercially available that can be
used to tailor surface properties in a myriad of ways. The two most important ways for depositing
silanes are by either liquid or gas phase deposition. Learn why the gas phase approach can be much more
reproducible, and it is automatable: the chemical vapor deposition of silanes avoids some of the
chemical uncertainty associated with solution deposition.
Subsurface Oxidation for Micropatterning Silicon (SOMS)
Surface patterning on silicon is critically important in research
and industry. In silicon semiconductor manufacturing, it is central to microchip fabrication. Learn
about a simple, straightforward tool for patterning silicon based on plasma oxidation through a stencil
mask. We term this method: Subsurface Oxidation for Micropatterning Silicon (SOMS).
YES’s Surface Modification Solutions for the Medical Device
Industry
Take a tour of the YES portfolio of equipment, services, and
solutions to modify materials, surfaces, and interfaces for optics and medical devices. Gain insight
into how patented YES processes to modify surfaces or create new materials for medical devices is
helping companies achieve groundbreaking throughput and cost efficiency.
Improvements in the Reliability, Costs and Processing of WLP/RDL
Circuits
Wafer-level Packaging (WLP) and Redistribution Layers (RDL)
circuits must incorporate multiple polyimide layers. In this paper, see the difference between curing
polyimide film under atmospheric versus vacuum process conditions. YES vacuum curing processes are shown
to significantly reduce process time and provide a larger process window with many advantages.
ABSTRACT : Better Thermal, Mechanical and Dielectric Properties of
Cured Polyimides Using Low Pressure Vacuum Cure Processing
Mechanical, thermal, physical and dielectric properties were
evaluated for different types of polyimide and PBO materials using the YES VertaCure vacuum cure system,
as compared to the atmospheric process.