The May meeting of the Silicon Valley Chapter of the IEEE Electronic Packaging Society (EPS) will feature a webcast by Dr. Zia Karim, Chief Technical Officer at YES, entitled “Results of Low-Temperature Polyimide Processing for Interconnect RDL in Next-Generation 3D Advanced IC Backend Applications.” Please visit the IEEE for details. This event will be held on Thursday, May […]
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Visit YES at the virtual IMAPS Device Packaging Conference from April 12-15! You may register now for a complimentary Partner Profile Only Badge, which is comparable to a free Exhibit Hall pass at an in-person show and enables you to chat with us and other Partners. (Note that the complimentary badge does not provide access to any presentations/technical content, […]
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